专用集成电路与系统国家重点实验室
讲座信息

时间:12月10日上午10点~12点
地点:张江微电子楼369室

报告一:

题目: Statistical Validation for Autonomous Driving Systems
报告人:Professor Xin Li, Duke University, IEEE Fellow

摘要:
Today's autonomous driving systems are equipped with a powerful computing platform to run multiple machine learning algorithms for environment perception (e.g., pedestrian detection) and motion control (e.g., vehicle stabilization). The design, implementation and validation of these systems have become increasingly challenging, with growing functional complexity in scale and features, the adoption of more distributed and networked architectural platforms, and stringent demands on various design constraints posed by performance, fault tolerance, reliability, extensibility and security. This presentation provides a preliminary discussion on novel techniques and methodologies for statistical validation of autonomous driving systems, supported by several case studies.

报告人简介:
Xin Li received the Ph.D. degree in Electrical and Computer Engineering from Carnegie Mellon University, Pittsburgh, PA in 2005, and the M.S. and B.S. degrees in Electronics Engineering from Fudan University, Shanghai, China in 2001 and 1998, respectively. He is currently a Professor in the Department of Electrical and Computer Engineering at Duke University, Durham, NC, and is leading the Institute of Applied Physical Sciences and Engineering (iAPSE) at Duke Kunshan University, Kunshan, Jiangsu, China. In 2005, he co-founded Xigmix Inc. to commercialize his PhD research, and served as the Chief Technical Officer until the company was acquired by Extreme DA in 2007. From 2009 to 2012, he was the Assistant Director for FCRP Focus Research Center for Circuit & System Solutions (C2S2), a national consortium working on next-generation integrated circuit design challenges. He is now on the Board of Directors for R&D Smart Devices (Hong Kong) and X&L Holding (Hong Kong). His research interests include integrated circuit, signal processing and data analytics.
Dr. Xin Li is an Associate Editor of IEEE TBME, IEEE TCAD, ACM TODAES, IEEE D&T, and JOLPE. He served on the Executive Committee of DAC, ACM SIGDA, IEEE TCCPS, and IEEE TCVLSI. He was the General Chair of ISVLSI, iNIS and FAC, and the Technical Program Chair of CAD/Graphics. He received the NSF CAREER Award in 2012, two IEEE Donald O. Pederson Best Paper Awards in 2013 and 2016, the DAC Best Paper Award in 2010, two ICCAD Best Paper Awards in 2004 and 2011, and the ISIC Best Paper Award in 2014. He also received six Best Paper Nominations from DAC, ICCAD and CICC. He is a Fellow of IEEE.

报告二:

题目:Analytical Modeling of Electromigration Failure for VLSI Interconnect Trees
报告人:陈海宝,讲师,上海交通大学电子信息与电气工程学院

摘要:
Electromigration (EM) is a major concern for VLSI interconnect reliability, particularly for interconnect trees with multi-branch metal wires representing continuously connected metal (Cu) lines terminated at diffusion barriers. For EM modeling and assessment, one important problem is to perform fast EM time to failure analysis for practical VLSI chips. Compact modeling for EM effects for interconnect tree has been studied recently to better EM signoff analysis. In this talk, we will introduce a first principle-based analytical solution of this problem. We derived the analytical expressions describing the hydrostatic stress evolution in several typical interconnect trees: 1) the straight-line three-terminal wires; 2) the T-shaped four-terminal wires; and 3) the cross-shaped five-terminal wires. The new approach solves the stress evolution in a multibranch tree by de-coupling the individual segments through the proper boundary conditions (BCs) accounting the interactions between different branches. By using Laplace transformation technique, analytical solutions are obtained for each type of the interconnect trees. The analytical solutions in terms of a set of auxiliary basis functions using the complementary error function agree well with the numerical analysis results.
For wires stressed under time-varying temperature, which is very typical for a practical chip working conditions, we will introduce exact analytic models for stress evolution of interconnect trees under different current density and varying segment length from the first principle. The stress evolution is modeled by two Korhonen’s equations coupled through boundary conditions which are solved with the Laplace transformation technique. The new analytical EM model is further extended to consider time-varying temperature stressing condition and initial non-zero residual stress. This analytical method is compared with the finite element method (FEM) tool COMSOL, the recently proposed eigenfunction-based method and the published EM simulator XSim. The comparison shows that the analytical solution agrees well with the results from the FEM numerical analysis. It uses much less terms compared to the eigenfunction method for the same accuracy. It also agrees very well with XSim, which is consistent with the previously reported measured results.

报告人简介:
陈海宝分别于2006年、2008年和2012年在西安交通大学理学院获得学士、硕士和博士学位。2012年4月加入华为公司,任IT产品线技术开发部研究工程师。2013年赴美国加州大学河滨分校电子工程系从事博士后研究,主要从事集成电路三维热方程的快速计算方法及电迁移可靠性问题方面的研究。2014年加入上海交通大学电子信息与电气工程学院,主要研究方向是集成电路设计自动化(EDA)、无线传感网络智能系统设计及大数据相关算法及应用等领域的研究。在IEEE TAC, IEEE TCAD, IEEE TDMR, IEEE TVLSI, ACM TODAES等国际权威学术期刊和DAC, ICCAD, DATE, ASPDAC等国际权威学术会议上发表学术论文35篇,其中SCI收录论文15篇,包括IEEE/ACM Transactions期刊论文9篇。2015年在EDA领域权威国际学术会议ASPDAC上获得最佳论文提名奖。陈海宝长期担任IEEE TCAD, IEEE TVLSI, IEEE TCAS I/II等国际期刊审稿人。现为IEEE Member,ACM Member。2016年起担任集成电路设计自动化领域SCI期刊Integration-the VLSI Journal编委(Associate Editor)。

联系人:陶俊

 
 
 
 

 

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