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讲座信息

题  目:Directed self-assembly of ABA triblock copolymer on chemical pattern via solvent annealing for sub-10nm fabrication
报告人:Dr. Shisheng Xiong(Institute for Molecular Engineering, the University of Chicago, and Argonne National Labs)
时  间:2015年12月15日周二14:00-15:00
地  点:邯郸校区微电子学楼B213会议室

Abstract
Directed self-assembly (DSA) of block copolymers (bcp) is a leading strategy to pattern at sub-lithographic resolution in the technology roadmap for semiconductors, and is the only known solution to fabricate nano-imprint templates for the production of bit pattern media. Integration of DSA with traditional top-down processes is a principal challenge, particularly with respect to the process used to anneal the polymer thin films. Thermal annealing is the most developed method, resembling track processing of photoresists on hotplates, and has been used in demonstrations of DSA closest to commercial applications. Solvent annealing is a more complicated process and is less manufacturing friendly, but offers advantages in terms of diversity of materials and domain structures that can be assembled, and has resulted in the DSA of the highest resolution features demonstrated to date. Here we report a DSA process based on lithographically defined chemical templates and solvent annealing to pattern and pattern transfer 8 nm features on a 16 nm pitch with precise controllable variation in pattern dimensions (± 5 percent) required for arranging bits of patterned media in circular tracks. Key innovations include: 1) implementing a quasi-equilibrium process using solvents in which the polymer assembles in the solvated state, 2) delineating and taking advantage of the thermodynamic properties of tri-block copolymer/solvent mixtures to allow for sub 10 nm features, and 3) optimizing a pattern transfer technology using reactive vapor phase precursors to selectively transform block copolymer domains into inorganic hard masks.

Biography
Dr. Shisheng Xiong graduated from Wuhan University with a bachelor degree in chemical engineering and master degree in electrical engineering. After working for a year in Shanghai institute of optics and fine mechanics, Chinese academy of sciences, he went to the united states of America to pursue a Ph.D degree. His Ph.D advisor was Prof. Jeffrey Brinker, a fellow of the National academy of engineering and a fellow of Sandia national labs, regent's professor of the University of New Mexico. Dr. Xiong obtained his Ph.D in nanoscience and microsystems in 2010, with a thesis on the 2D interfacial assembly of quantum dots and its coupling with photonic crystal cavities. He joined Paul F. Nealey's group as a postdoctoral associate at University of Chicago, focusing on the directed self-assembly (DSA) of block copolymers for alternative lithography. From 2012 to 2014, Dr. Xiong worked as a visiting scientist for Western Digital on bit patterned media using DSA and nanoimprinting. He came back to University of Chicago in 2014 and is now assigned as a research scientist in Institute of molecular engineering in Argonne national lab. His research interest is centered on DSA for sub-10nm lithography, in collaboration with Intel, Seagate, TEL and IMEC. Dr. Xiong has published in JACS, Nano Letters, etc. and filed two patents in USA and seven patents in China. He is a member of SPIE and AAAS.

 
 
 
 

 

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