讲座信息:
Flip-chip Interconnection and Assembly Technology for SOC and SOP

 

Time: 9:30 a.m. – 10:30 a.m., April 8th, 2004

Place: B325 Computer Center

Speaker: Philip C. H. Chan

          Professor of Electrical and Electronic Engineering and Dean of Engineering

          The Hong Kong University of Science and Technology

          Clear Water Bay, Kowloon, Hong Kong SAR, China

 

Abstract – Integrated circuit technology is the foundation of modern electronics, communication and information technologies. Using modern integrated circuit technology billions of transistors can be integrated in a square centimeter of silicon. Information can be processed at the rate of billion operations per second in the silicon chip. To support this processing capability, high-density interconnection technology is essential to distribute the signal into and from the silicon chip to the outside world. Flip-chip is a high-density and highly reliability interconnection technology designed for System-On-Chip (SOC) and System-On-Package (SOP) applications. For applications involve RF, sensors, optical and MEMS components, SOP may provide a more cost effect solution than SOC. After summarizing the key developments in this field, I shall go through one SOP application in detail, namely, Silicon-on-Organic integration of a 2.4 GHz VCO using high Q copper inductors and solder-bumped flip chip technology.

 
 

 

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